Gestapelter Verbindungskühlkörper

Dissipateur d'interconnexion empilé

Stacked interconnect heat sink

Abstract

An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally conductive core. The active via is connected to a corresponding heat spreader via that passes through the thermally conductive core.

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