半導体装置

Semiconductor device

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique capable of reducing a chip size. <P>SOLUTION: Wiring outside a cell extending on a macro cell MC3 in an X direction is constituted using an upper wiring layer rather than a terminal Ts for the signal of the macro cell MC3. The terminal Ts is constituted such that it is extended in a Y direction (a direction crossing the X direction) such that it is secured for the plurality of channels of the wiring outside the cell. Connection between the macro cell MC3 and the wiring outside the cell is carried out via the terminal Ts for the signal. <P>COPYRIGHT: (C)2007,JPO&INPIT
【課題】チップサイズを縮小する。 【解決手段】マクロセルMC3上をX方向に延在するセル外配線をマクロセルMC3の信号用の端子Tsよりも上層の配線層で構成し、この端子Tsをセル外配線の複数のチャネル分を確保するように、Y方向(X方向に交差する方向)に延在させて構成する。マクロセルMC3と、セル外配線との接続をこの信号用の端子Tsを介して行う。 【選択図】図10

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