半導体受光素子収納用パッケージ

Semiconductor photodetector element housing package

Abstract

【課題】Pbを用いない環境に優しいパッケージで、キャビティ部の気密信頼性の高い安価な半導体受光素子収納用パッケージを提供する。 【解決手段】平板形状のセラミック基体11と、これと略同じ外形寸法で窓枠形状のセラミック枠体12の間に複数本の外部接続端子13が熱硬化性樹脂接着材14で接合されて有し、枠体12の開口から露出する基体11の表面と、枠体12の内周壁面で半導体受光素子15を収納するためのキャビティ部16を設けると共に、外部接続端子13をそれぞれの先端部をキャビティ部16側と、外周側に露出させる状態で設ける半導体受光素子収納用パッケージ10であって、外部接続端子13の内の1又は複数本に、セラミック基体11と、セラミック枠体12の間の熱硬化性樹脂接着材14で覆われる部分から延設し、セラミック枠体12幅に包含されるダミーリード18を有する。 【選択図】図1
<P>PROBLEM TO BE SOLVED: To provide a semiconductor photodetector element housing package, as an environment-friendly package without using Pb, having a cavity unit with high reliability in tightness. <P>SOLUTION: A semiconductor photodetector element housing package 10 includes two or more external connection terminals 13 bonded between a plate-shaped ceramic base 11 and a ceramic frame body 12, which has a window frame shape and external dimensions almost equal to the ceramic body 11 with thermosetting resin adhesive 14, and a cavity unit 16 for storing the semiconductor photodetector element 15 by the surface of the base 11 exposed from an opening of a frame 12 and an inner wall face of the frame 12. The external connection terminals 13 is so arranged that each top thereof is exposed on the side of cavity unit 16 and the external boundary side. One or more external connection terminals 13 have a dummy lead 18 extended from a part, which is covered by the thermosetting resin adhesive 14 between the ceramic base 11 and the ceramic frame body 12, and the dummy lead 18 is within a width of the ceramic frame 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

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